Intel presents a new architectural design for servers with a technology transfer internal data at 100 Gbps

Intel is currently working on replacing the architecture of server racks to provide a more efficient system that would separate CPU, storage, power and network resources in individual components that could then be changed when necessary. In the same vein, power supply units and cooling would be shared by multiple CPUs rather than having separate power per server. The same components such as memory, network resources, storage resources can be shared within a rack and not tied to a particular server. To improve performance compared to the current architecture, it is necessary to build interconnect components much faster and the depth is precisely building an interconnect component capable of reaching 100 Gbps.


Lisa Graff, Vice President Group Marketing DataCenter, confirmed this development last week reported working in partnership with OEMs and software developers to design an architecture capable of becoming a standard. According to Ars Technica, the first version will be available later in 2014. Ms. Graff believes that this architecture can mix the best components in a rack and the sharing of resources such as memory or storage offers better performance and a more refined architecture.


Note that this new development axis complements that Facebook offers with its Open Compute Project whose goal is also to purify up servers, a project for which the social network is already working in partnership with Intel. But until now the main obstacle to these racks "disaggregated" was the low speed data transmission within the network. To this end, Intel has developed technology "Silicon Photonics", which provides transfer speeds of up to 100 Gbps. "Silicon Photonics, which is manufactured with inexpensive silicon rather than with exotic and expensive optical materials provides a decisive advantage in terms of cost compared to older optical technology and offers more speed, reliability," said Intel last January during the first presentation of its technology.

  
Besides Intel, IBM is also developing a substantially similar technology called "Silicon nanophotonics" which the manufacturer believes that it is now ready to enter mass production. This presentation is made during the Intel Developer's Forum held in Beijing and the first customers of this technology for server racks are large Chinese technology companies such as Baidu, Alibaba, or China Telecom. Alongside this announcement, the company of Santa Clara also presented a new SOC (System on a chip) on an Atom for data centers. The new SOC combines the power consumption of a processor for phone functions typical for servers as virtualization technologies or capabilities of error correction (ECC). In December was presented Atom processor SOC 64 bits. Today is unveiled a new model for storage systems and many manufacturers will showcase their products in the process. Finally, the chipmaker announced that updates its Xeon E3, E5 and E7 would be available later in the year.